Wafer Processing

Chemical Mechanical Polishing

The EBARA CMP family members for 200 and 300 mm wafers are designed to exceed today’s requirements on latest CMP processes for the most advanced application.

Ultra Fine Plating

The Ultra Fine Plating (UFP) Series can be employed in all "through mask plating processes", as used for redistribution and bumping in the wafer level packaging processes. The UFP series is designed for modular configuration and can easily be adapted to customer-specific processes.

Bevel Polishing Tools

EBARA have developed a tool that not only cleans but can also reshape the Bevel to a specific profile by using a mechanical ‘slurry free’ process that has been confirmed to be effective in maintaining production yield.